Piezoelectric element, multilayered piezoelectric element, liquid discharge head, liquid discharge apparatus, ultrasonic motor, optical apparatus, and electronic apparatus

ABSTRACT

A lead-free piezoelectric element that stably operates in a wide operating temperature range contains a lead-free piezoelectric material. The piezoelectric element includes a first electrode, a second electrode, and a piezoelectric material that includes a perovskite-type metal oxide represented by (Ba 1-x Ca x ) a (Ti 1-y Zr y )O 3  (1.00≦a≦1.01, 0.02≦x≦0.30, 0.020≦y≦0.095, and y≦x) as a main component and manganese incorporated in the perovskite-type metal oxide. The manganese content relative to 100 parts by weight of the perovskite-type metal oxide is 0.02 parts by weight or more and 0.40 parts by weight or less on a metal basis.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.14/130,671 filed Jan. 2, 2014, and which is a National Stage entry ofPCTJP2012/066837, filed Jun. 26, 2012, which claims priority to JapanesePatent Application No. 2011-149361, filed Jul. 5, 2011, all of which arehereby incorporated by reference herein in their entireties.

TECHNICAL FIELD

The present invention generally relates to piezoelectric elements,multilayered piezoelectric elements, liquid discharge heads, liquiddischarge apparatuses, ultrasonic motors, optical apparatuses, andelectronic apparatuses. In particular, the present invention relates toa piezoelectric element, a multilayered piezoelectric element, a liquiddischarge head, a liquid discharge apparatus, an ultrasonic motor, anoptical apparatus, and an electronic apparatus that do not contain leadand operate stably in operating temperature ranges.

BACKGROUND ART

ABO₃ perovskite-type metal oxides such as lead zirconate titanate(referred to as “PZT” hereinafter) are typically used as piezoelectricmaterials. Since PZT contains lead as the A site element, a concern hasbeen raised over PZT's impact on the environment. Thus, piezoelectricmaterials that use lead-free perovskite-type metal oxides are highlydesirable.

An example of a lead-free piezoelectric material that contains aperovskite-type metal oxide is barium titanate. Studies on anddevelopment of barium-titanate-based materials been conducted to improveproperties of barium titanate and devices that use such materials havebeen disclosed. PTL 1 discloses a piezoelectric element that uses bariumtitanate with the addition of Mn, Fe, or Cu and with some of the A sitesbeing substituted with Ca. These piezoelectric elements have mechanicalquality factors superior to those of barium titanate but have lowpiezoelectric properties. Thus, high voltage has been required to drivepiezoelectric elements.

PTL 2 discloses an actuator and a liquid discharge head that use amaterial prepared by adding Ba and B to barium titanate. This materialhas an advantage of low sintering temperature but has a piezoelectricconstant d₃₃ as low as 65 [pC/N]. Thus, high voltage has been requiredto drive the piezoelectric element.

Piezoelectric materials having a Curie temperature of 80° C. or less mayundergo depolarization in a severe environment such as car compartmentsunder summer sun and may lose piezoelectricity as a result.Piezoelectricity may be lost by heat generated as a result of driving ofactuators.

CITATION LIST Patent Literature

PTL 1 Japanese Patent Laid-Open No. 2010-120835

PTL 2 Japanese Patent Laid-Open No. 2011-032111

SUMMARY OF INVENTION Technical Problem

The invention provides a lead-free piezoelectric element that stablyoperates in a wide operating temperature range.

Solution to Problem

A first aspect of the invention provides a piezoelectric element thatincludes a first electrode, a second electrode, and a piezoelectricmaterial. The piezoelectric material includes a perovskite-type metaloxide represented by general formula (1) as a main component, andmanganese incorporated in the perovskite-type metal oxide:

(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (where 1.00≦a≦1.01, 0.02≦x≦0.30,0.020≦y≦0.095, and y≦x)  (1)

A manganese content relative to 100 parts by weight of theperovskite-type metal oxide is 0.02 parts by weight or more and 0.40parts by weight or less on a metal basis.

A second aspect of the present invention provides a multilayeredpiezoelectric element that includes piezoelectric material layers andelectrodes including an internal electrode. The piezoelectric materiallayers and the electrodes are alternately stacked. The piezoelectricmaterial layers each contain a perovskite-type metal oxide representedby general formula (1) as a main component, and manganese incorporatedin the perovskite-type metal oxide:

(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (where 1.00≦a≦1.01, 0.02≦x≦0.30,0.020≦y≦0.095, and y≦x)  (1)

The manganese content relative to 100 parts by weight of theperovskite-type metal oxide is 0.02 parts by weight or more and 0.40parts by weight or less on a metal basis.

A third aspect of the present invention provides a liquid discharge headthat includes a liquid reservoir including a vibrating unit thatincludes the piezoelectric element or the multilayered piezoelectricelement described above, and a discharge port in communication with theliquid reservoir. A fourth aspect of the present invention provides aliquid discharge apparatus that includes a transport unit configured totransport a recording medium and the liquid discharge head describedabove.

A fifth aspect of the present invention provides an ultrasonic motorthat includes a vibrating member including the piezoelectric element orthe multilayered piezoelectric described above and a moving member incontact with the vibrating member. A sixth aspect of the presentinvention provides an optical apparatus that includes a driving unitincluding the ultrasonic motor described above. A seventh aspect of thepresent invention provides an electronic apparatus that includes apiezoelectric acoustic component including the piezoelectric element orthe multilayered piezoelectric element described above.

Advantageous Effects of Invention

A lead-free piezoelectric element that stably operates in a wideoperating temperature range can be provided. A liquid discharge head, aliquid discharge apparatus, an ultrasonic motor, an optical apparatus,and an electronic apparatus that use this lead-free piezoelectricelement can also be provided.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic view showing a piezoelectric element according toan embodiment of the invention.

FIGS. 2A and 2B show a liquid discharge head according to an embodimentof the invention.

FIGS. 3A and 3B are each a schematic view showing an ultrasonic motoraccording to an embodiment of the invention.

FIG. 4 is a graph showing the relationship between x and y ofpiezoelectric ceramics of Production Examples 1 to 73.

FIGS. 5A and 5B are each a cross-sectional view showing a multilayeredpiezoelectric element according to an embodiment of the invention.

FIG. 6 is a schematic view showing a liquid discharge apparatusaccording to an embodiment of the invention.

FIG. 7 is another schematic view showing the liquid discharge apparatus.

FIGS. 8A and 8B are schematic views showing an optical apparatusaccording to an embodiment of the invention.

FIG. 9 is a schematic view showing the optical apparatus.

FIG. 10 is a schematic view showing an electronic apparatus according toan embodiment of the invention.

DESCRIPTION OF EMBODIMENTS

Embodiments of the invention will now be described.

FIG. 1 is a schematic view showing a piezoelectric element according toone embodiment of the present invention. The piezoelectric elementincludes a piezoelectric material 2, and a first electrode 1 and asecond electrode 3 associated with the piezoelectric material 2.

The piezoelectric element includes at least a first electrode, apiezoelectric material, and a second electrode. The piezoelectricmaterial contains a perovskite-type metal oxide represented by generalformula (1) as a main component and manganese (Mn) incorporated in theperovskite-type metal oxide:

(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (1.00≦a≦1.01, 0.02≦x≦0.30,0.020≦y≦0.095, and y≦x)  (1)

The Mn content relative to 100 parts by weight of the metal oxide is0.02 parts by weight or more and 0.40 parts by weight or less on a metalbasis.

Each of the first and second electrodes is constituted by anelectrically conductive layer having a thickness of about 5 nm to about2000 nm. The material used to form the electrodes may be any materialcommonly used in piezoelectric elements. Examples thereof include metalssuch as Ti, Pt, Ta, Ir, Sr, In, Sn, Au, Al, Fe, Cr, Ni, Pd, Ag, and Cuand compounds thereof.

The first and second electrodes may each be composed of one of thesematerials or may each be constituted by a multilayered structureprepared by stacking two or more of these materials. The first andsecond electrodes may be composed of materials different from eachother.

The method for making the first and second electrodes may be any. Forexample, the electrodes may be formed by baking a metal paste, bysputtering, or by vapor deposition. The first and second electrode maybe patterned as desired.

In this description, a perovskite-type metal oxide refers to a metaloxide having a perovskite-type structure which is ideally a cubiccrystal structure as described in Iwanami Rikagaku Jiten, 5th edition(published Feb. 20, 1998 by Iwanami Shoten Publishers). A metal oxidehaving a perovskite-type structure is usually expressed by a chemicalformula, ABO₃. Element A and element B in a perovskite-type metal oxidetake form of ions and occupy particular positions in a unit cell calledA sites and B sites, respectively. For example, in a unit cell of acubic crystal system, element A occupies vertexes of the cube andelement B occupies the body-centered position of the cube. Element O isoxygen in the form of an anion and occupies face-centered positions ofthe cube.

In the metal oxide represented by general formula (1) above, barium (Ba)and calcium (Ca) are metal elements that occupy A sites and titanium(Ti) and zirconium (Zr) are metal elements that occupy B sites. Notethat some of the Ba and Ca atoms may occupy B sites and/or some of theTi and Zr atoms may occupy A sites.

In general formula (1), the molar ratio of the B-site element to O is1:3. A metal oxide having a B-site element/O ratio slightly deviatedtherefrom, e.g., 1.00:2.94 to 1.00:3.06, is still included in the scopeof the present invention as long as the metal oxide has aperovskite-type structure as a main phase.

Structural analysis through X-ray diffraction or electron beamdiffraction can be used to determine whether a metal oxide has aperovskite-type structure, for example.

The piezoelectric material may take any form, for example, a ceramic,powder, single crystal, film, slurry, or the like but is preferably aceramic. In this description, a “ceramic” refers to an aggregate (alsoreferred to as bulk) of crystal grains basically composed of a metaloxide and consolidated by heat treatment, and is a polycrystal. A“ceramic” may also refer to a ceramic that has been processed aftersintering.

In general formula (1) above, a represents the ratio of the total molaramount of Ba and Ca in A sites to the total molar amount of Ti and Zr inB sites and is in a range of 1.00≦a≦1.01. When a is smaller than 1.00,abnormal grain growth readily occurs and the mechanical strength of thematerial is decreased. When a is greater than 1.01, the temperatureneeded for grain growth becomes excessively high and sintering cannot beachieved in a common firing furnace. Here, “sintering cannot beachieved” refers to a state in which the density is not sufficientlyincreased or a large number of pores and defects are present in thepiezoelectric material.

In general formula (1), x represents the molar ratio of Ca in A sitesand is in a range of 0.02≦x≦0.30. When x is less than 0.02, thedielectric loss (tan δ) increases. When the dielectric loss isincreased, the amount of heat generated when a voltage is applied to thepiezoelectric element to drive the piezoelectric element increases andthe drive efficiency may be degraded. When x is greater than 0.30, thepiezoelectric property may not be sufficient.

In general formula (1), y represents the molar ratio of Zr in B sitesand is in a range of 0.020≦y≦0.095. When y is less than 0.020, thepiezoelectric property may not be sufficient. When y is greater than0.095, the Curie temperature (T_(c)) becomes less than 85° C. and thepiezoelectric property will be lost at high temperature.

In this description, a Curie temperature refers to a temperature atwhich ferroelectricity is lost. Examples of the method for detecting thetemperature include a method of directly measuring the temperature atwhich ferroelectricity is lost by varying the measurement temperatureand a method of measuring the dielectric constant using minute AC fieldswhile varying the measurement temperature and determining thetemperature at which the dielectric constant is maximal.

In general formula (1), the Ca molar ratio x and the Zr molar ratio ysatisfy y≦x. When y>x, the dielectric loss may increase and theinsulating property may be insufficient. When all of the rangesconcerning x and y described heretofore are satisfied simultaneously,the crystal structure phase transition temperature (phase transitionpoint) can be shifted from near room temperature to a temperature belowthe operating temperature range and thus the device can be stably drivenin a wide temperature range.

The method for determining the composition of the piezoelectric materialused in the piezoelectric element is not particularly limited. Examplesof the method include X-ray fluorescence analysis, inductively coupledplasma (ICP) atomic emission spectroscopy, and atomic absorptionspectrometry. The weight ratios and compositional ratios of the elementscontained in the piezoelectric material can be determined by any ofthese methods.

The piezoelectric material used in the piezoelectric element has a Mncontent of 0.02 parts by weight or more and 0.40 parts by weight or lesson a metal basis relative to 100 parts by weight of the metal oxide. Thepiezoelectric material having a Mn content within this range exhibits animproved insulation property and an improved mechanical quality factor.Here, the mechanical quality factor refers to a factor that indicates anelastic loss caused by oscillation when the piezoelectric material isused in an oscillator. The magnitude of the mechanical quality factor isobserved as a sharpness of a resonance curve in impedance measurement.In other words, the mechanical quality factor is a factor that indicatesthe sharpness of the resonance of an oscillator. Presumably, theinsulating property and the mechanical quality factor are improved byintroduction of defect dipoles due to Mn having a valence different fromthat of Ti and Zr and generation of internal electric fields resultingtherefrom. When an internal electric field is present, a piezoelectricelement formed by using the piezoelectric material and operated byapplying voltage exhibits long-term reliability.

The term “on a metal basis” with reference to the Mn content refers to avalue determined by first determining the oxide-based amounts ofelements constituting the metal oxide represented by general formula (1)based on the Ba, Ca, Ti, Zr, and Mn contents measured by XRF, ICP atomicemission spectroscopy, atomic absorption spectroscopy, or the like andthen calculating the ratio of the weight of Mn relative to 100 parts byweight of the total amount of the elements constituting the metal oxideon a weight basis.

When the Mn content is less than 0.02 parts by weight, the effect of thepolarization treatment is not sufficient to drive the device. When theMn content is greater than 0.40 parts by weight, the piezoelectricproperty is not sufficient and crystals having a hexagonal structure notcontributing to the piezoelectric property emerge.

Manganese is not limited to metallic Mn and may take any form as long asmanganese is contained as a component in the piezoelectric material. Forexample, manganese may be dissolved in B sites or may be included ingrain boundaries. Manganese may take the form of a metal, ion, oxide,metal salt, or complex in the piezoelectric material. Preferably,manganese is dissolved in B sites from the viewpoints of insulatingproperty and sinterability. When manganese is dissolved in B sites, apreferable range of the molar ratio A/B for resonator devices (harddevices), such as piezoelectric sensors, piezoelectric transformers, andultrasonic motors, that operate at resonance frequencies is0.993≦A/B≦0.998, where A is the molar amount of Ba and Ca in A sites andB is the molar amount of Ti, Zr, and Mn in B sites. A piezoelectricelement having an A/B within this range exhibits a high piezoelectricconstant and a high mechanical quality factor and thus forms a devicehaving superior durability. A preferable range of A/B for displacementactuators (soft devices) such as optical pickup actuators and liquiddischarge heads operating at non-resonant frequencies is0.996≦A/B≦0.999. Piezoelectric elements having an A/B within theseranges can exhibit a high piezoelectric constant, a low dielectric loss,and high durability.

The piezoelectric material used in the piezoelectric element may containcomponents (hereinafter referred to as auxiliary components) other thanthe compound represented by general formula (1) and Mn as long as theproperties are not changed. The total content of the auxiliarycomponents may be 1.2 parts by weight or less relative to 100 parts byweight of the metal oxide represented by general formula (1). When theauxiliary component content exceeds 1.2 parts by weight, thepiezoelectric property and the insulating property of the piezoelectricmaterial may be degraded. The content of the metal elements other thanBa, Ca, Ti, Zr, and Mn among the auxiliary components is preferably 1.0parts by weight or less on an oxide basis or 0.9 parts by weight or lesson a metal basis relative to the piezoelectric material. In thisdescription, “metal elements” include semimetal elements such as Si, Ge,and Sb.

When the content of the metal elements other than Ba, Ca, Ti, Zr, and Mnamong the auxiliary components exceeds 1.0 parts by weight on an oxidebasis or 0.9 parts by weight on a metal basis relative to thepiezoelectric material, the piezoelectric property and the insulatingproperty of the piezoelectric material may be significantly degraded.The total content of Li, Na, Mg, and Al among the auxiliary componentsmay be 0.5 parts by weight or less on a metal basis relative to thepiezoelectric material. When the total content of Li, Na, Mg, and Alamong the auxiliary components exceeds 0.5 parts by weight on a metalbasis relative to the piezoelectric material, insufficient sintering mayoccur. The total of Y and V among the auxiliary components may be 0.2parts by weight or less on a metal basis relative to the piezoelectricmaterial. When the total content of Y and V exceeds 0.2 parts by weighton a metal basis relative to the piezoelectric material, thepolarization treatment may become difficult.

Examples of the auxiliary components include sintering aids such as Siand Cu. Commercially available Ba and Ca raw materials contain Sr as anunavoidable impurity and thus the piezoelectric material may contain animpurity amount of Sr. Similarly, a commercially available Ti rawmaterial contains Nb as an unavoidable impurity and a commerciallyavailable Zr raw material contains Hf as an unavoidable impurity. Thus,the piezoelectric material may contain impurity amounts of Nb and Hf.

The method for measuring the weights of the auxiliary components is notparticularly limited. Examples of the method include X-ray fluorescenceanalysis, ICP atomic emission spectroscopy, and atomic absorptionspectrometry.

The piezoelectric material used in the piezoelectric element may beconstituted by crystal grains having an average circular equivalentdiameter of 1 μm or more and 10 μm or less. When the average circularequivalent diameter is within this range, the piezoelectric material canexhibit good piezoelectric property and mechanical strength. When theaverage circular equivalent diameter is less than 1 μm, thepiezoelectric property may be insufficient. When the average circularequivalent diameter is more than 10 μm, the mechanical strength may bedegraded. A more preferable range is 3 μm or more and 8 μm or less.

In this description, a “circular equivalent diameter” refers to what isgenerally known as a “projected area diameter” in microscopy andindicates the diameter of a circle having the same area as the projectedarea of a crystal grain. In this invention, the method for measuring thecircular equivalent diameter is not particularly limited. For example,an image of a surface of a piezoelectric material may be obtained with apolarizing microscope or a scanning electron microscope and the imagemay be processed to determine the circular equivalent diameter. Sincethe optimum magnification differs depending on the grain diameter to beanalyzed, an optical microscope and an electron microscope may beproperly used. The circular equivalent diameter may be determined froman image of a polished surface or a cross section instead of a surfaceof the material.

The relative density of the piezoelectric material used in thepiezoelectric element may be 93% or more and 100% or less.

When the relative density is less than 93%, the piezoelectric propertyand/or mechanical quality factor may not be satisfactory and themechanical strength may be degraded.

The main component of the piezoelectric material used in thepiezoelectric element has x and y satisfying 0.125≦x≦0.175 and0.055≦y≦0.090, respectively and the Mn content is 0.02 parts by weightor more and 0.10 parts by weight or less relative to 100 parts by weightof the metal oxide.

A piezoelectric element that uses a piezoelectric material within thiscompositional range is particularly suited for a displacement actuator(a.k.a., soft device) such as an optical pickup actuator or a liquiddischarge head. When x indicating the molar ratio of Ca is less than0.125, the durability may be degraded. When x is larger than 0.175, thepiezoelectric strain constant may be decreased. Preferably,0.140≦x≦0.175. When y indicating the molar ratio of Zr is less than0.055, the piezoelectric strain constant may be decreased. When y isgreater than 0.09, the Curie temperature will decrease and thus theoperating temperature range of the device may be narrowed. Preferably,0.055≦y≦0.075. When the Mn content is less than 0.02 parts by weight,the polarization treatment may not be conducted satisfactorily. At a Mncontent greater than 0.10 parts by weight, the piezoelectric strainconstant may be decreased. A preferable range for a is 1.000≦a≦1.005.

The main component of the piezoelectric material used in thepiezoelectric element preferably has x and y respectively satisfying0.155≦x≦0.300 and 0.041≦y≦0.069. The Mn content is preferably 0.12 partsby weight or more and 0.40 parts by weight or less on a metal basisrelative to 100 parts by weight of the main component metal oxide.

A piezoelectric element using the piezoelectric material within thiscompositional range is particularly suited for resonance devices (harddevices) such as piezoelectric sensors, piezoelectric transformers, andultrasonic motors. When x indicating the molar ratio of Ca is less than0.155, the mechanical quality factor may be decreased. When x is greaterthan 0.300, the piezoelectric strain constant may be degraded.Preferably, 0.160≦x≦0.300. When y indicating the molar ratio of Zr isless than 0.041, the piezoelectric strain constant may be decreased.When y is greater than 0.069, the operating temperature range of thedevice may be narrowed. Preferably, 0.045≦y≦0.069. When the Mn contentis less than 0.12 parts by weight, the mechanical quality factor may bedecreased and the power consumption during operation of the device at aresonant frequency may increase. When the Mn content is greater than0.40 parts by weight, the piezoelectric strain constant may be decreasedand a higher voltage may be needed to drive the device. Preferably, theMn content is 0.20 parts by weight or more and 0.40 parts by weight orless. A preferable range for a is 1.004≦a≦1.009.

A method for making the piezoelectric material used in the piezoelectricelement is not particularly limited. In order to make a piezoelectricceramic, solid powders such as oxides, carbonate salts, nitrate salts,oxalate salts, and the like containing elements constituting the ceramicmay be sintered at a normal pressure, which is a typical process. Theraw materials are metal compounds such as a Ba compound, a Ca compound,a Ti compound, a Zr compound, and a Mn compound.

Examples of the Ba compound that can be used include barium oxide,barium carbonate, barium oxalate, barium acetate, barium nitrate, bariumtitanate, barium zirconate, and barium zirconate titanate.

Examples of the Ca compound that can be used include calcium oxide,calcium carbonate, calcium oxalate, calcium acetate, calcium titanate,and calcium zirconate.

Examples of the Ti compound that can be used include titanium oxide,barium titanate, barium zirconate titanate, and calcium titanate.

Examples of the Zr compound that can be used include zirconium oxide,barium zirconate, barium zirconate titanate, and calcium zirconate.

Examples of the Mn compound that can be used include manganesecarbonate, manganese oxide, manganese dioxide, manganese acetate, andtrimanganese tetraoxide.

The raw materials for adjusting the molar ratio a, i.e., the molaramount of Ba and Ca in A sites to the molar amount of Ti and Zr in Bsites of the piezoelectric ceramic used in the piezoelectric element arenot particularly limited. The same effect can be achieved from a Bacompound, a Ca compound, a Ti compound, and a Zr compound.

The method for granulating raw material powders of the piezoelectricceramic used in the piezoelectric element is not particularly limited.From the viewpoint of uniformity of particle diameter of the resultingpowder, a spray dry method may be employed.

Examples of the binder used in granulation include polyvinyl alcohol(PVA), polyvinyl butyral (PVB), and acrylic resins. The amount of binderadded is preferably 1 to 10 parts by weight and more preferably 2 to 5parts by weight from the viewpoint of increasing the density of acompact.

The method for sintering the piezoelectric ceramic used in thepiezoelectric element is not particularly limited. Sintering may beconducted with an electric furnace or a gas furnace or by an electricheating method, a microwave sintering method, a millimeter wavesintering method, or hot isostatic pressing (HIP). Sintering using anelectric furnace or gas may be conducted in a continuous furnace or abatch furnace.

The sintering temperature of the ceramic in the sintering methoddescribed above is not particularly limited. The sintering temperaturemay be a temperature that allows the compounds to react and undergosufficient crystal growth. The sintering temperature is preferably 1200°C. or more and 1550° C. or less and more preferably 13000 or more and1480° C. or less from the viewpoint of making the grain diameter of theceramic to be within the range of 1 μm to 10 μm. A piezoelectric ceramicsintered within this temperature range exhibits a good piezoelectricproperty.

In order to stabilize the properties of the piezoelectric ceramicobtained by sintering while achieving high reproducibility, thesintering temperature may be kept constant within the above describedrange and sintering may be conducted for 2 to 24 hours. A two-stepsintering method may be employed but rapid temperature changes are notdesirable from the viewpoint of productivity.

The piezoelectric ceramic may be heat-treated at a temperature of 1000°C. or higher after being polished. When a piezoelectric ceramic ismechanically polished, a residual stress occurs inside the piezoelectricceramic. This residual stress can be relaxed by heat-treating at 1000°C. or higher and the piezoelectric property of the piezoelectric ceramiccan be further improved. The heat treatment also has an effect ofeliminating raw material powders, such as barium carbonate, precipitatedin grain boundary portions. The amount of time for the heat treatment isnot particularly limited but may be 1 hour or longer.

The piezoelectric element may have polarization axes oriented in aparticular direction. When polarization axes are oriented in aparticular direction, the piezoelectric constant of the piezoelectricelement is increased. The polarization method for the piezoelectricelement is not particularly limited. The polarization treatment may beconducted in air or in silicone oil. The temperature during polarizationmay be 60° C. to 100° C. but optimum conditions slightly vary dependingon the composition of the piezoelectric ceramic constituting the device.The electric field applied to conduct the polarization treatment may be800 V/mm to 2.0 kV/mm.

The piezoelectric constant and mechanical quality factor of thepiezoelectric element can be calculated from a resonant frequency and anantiresonant frequency measured with a commercially available impedanceanalyzer on the basis of Electronic Materials Manufacturers Associationof Japan Standard (EMAS-6100). This method is hereinafter referred to asa resonance-antiresonance method.

Multilayered Piezoelectric Element

Multilayered piezoelectric elements according to embodiments of theinvention will now be described.

A multilayered piezoelectric element according to an embodiment isconstituted by alternately stacking piezoelectric material layers andelectrodes (including one or more inner electrodes). The piezoelectricmaterial layers are each composed of a piezoelectric material thatcontains a perovskite-type metal oxide represented by general formula(1) below as a main component and manganese (Mn) incorporated in theperovskite-type metal oxide:

(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (1.00≦a≦1.01, 0.02≦x≦0.30,0.020≦y≦0.095, and y≦x)  (1)

The Mn content is 0.02 parts by weight or more and 0.40 parts by weightor less on a metal basis relative to 100 parts by weight of the metaloxide.

FIGS. 5A and 5B are each a cross-sectional view showing a structure of amultilayered piezoelectric element according to one embodiment. Themultilayered piezoelectric element includes piezoelectric materiallayers and electrodes (including one or more inner electrodes) that arealternately stacked. The piezoelectric material layers are composed ofthe aforementioned piezoelectric material. The electrodes may includeinternal electrodes and external electrodes.

FIG. 5A shows a multilayered piezoelectric element according to anembodiment. The multilayered piezoelectric element includes twopiezoelectric material layers 54 and one layer of an inner electrode 55alternately stacked, and the resulting stack is sandwiched between afirst electrode 51 and a second electrode 53. The number of layers ofthe piezoelectric material layers and the number of layers of innerelectrodes may be increased as shown in FIG. 5B and are not particularlylimited.

FIG. 5B shows a multilayered piezoelectric element according to anotherembodiment. The multilayered piezoelectric element includes nine layersof piezoelectric material layers 504 and eight layers of innerelectrodes 505 that are alternately stacked, and the resulting stack issandwiched between a first electrode 501 and a second electrode 503. Anexternal electrode 506 a and an external electrode 506 b forshort-circuiting the inner electrodes alternately stacked are disposedon side surfaces of the stack.

The inner electrodes 55 and 505 and external electrodes 506 a and 506 bmay have a size and a shape different from those of the piezoelectricmaterial layers 54 and 504 and may be divided into a plurality ofsegments.

Each of the inner electrodes 55 and 505 and the external electrodes 506a and 506 b is constituted by a conductive layer having a thickness ofabout 5 nm to 2000 nm. The material therefor is not particularly limitedand any material that is usually used in piezoelectric elements can beused. Examples of such a material include metals such as Ti, Pt, Ta, Ir,Sr, In, Sn, Au, Al, Fe, Cr, Ni, Pd, Ag, and Cu and compounds thereof.Each of the inner electrodes 55 and 505 and the external electrodes 506a and 506 b may be composed of one of these materials or a mixture or analloy of two or more of these materials, or may be constituted by amultilayered structure prepared by stacking two or more of thesematerials. The electrodes may be composed of materials different fromeach other. The inner electrodes 55 and 505 may be mainly composed of Nisince Ni is a low-cost electrode material.

As shown in FIG. 5B, the electrodes including the inner electrodes 505may be short-circuited from each other to make driving voltage phasesmatch. For example, the inner electrodes 505, the first electrode 501,and the second electrode 503 may be short-circuited in an alternatingmanner. The form of short-circuiting between the electrodes is notparticularly limited. Electrodes and/or wires may be formed on sidesurfaces of a multilayered piezoelectric element to conductshort-circuiting, or through holes penetrating the piezoelectricmaterial layers 504 may be formed and filled with a conductive materialso as to short-circuit the electrodes.

The method for making a multilayered piezoelectric element is notparticularly limited. One example is a method that includes a step (A)of preparing slurry by dispersing a metal compound powder containing atleast Ba, Ca, Ti, Zr, and Mn, a step (B) of obtaining a compact byplacing the slurry on a substrate, a step (C) of forming an electrode onthe compact, and a step (D) of obtaining a multilayered piezoelectricelement by sintering the compact on which the electrode has been formed.

In this specification, a “powder” refers to a group of solid particles.A powder may be a group of particles that each contain Ba, Ca, Ti, Zr,and Mn or a group of a plurality of types of particles containingdifferent elements.

Examples of the metal compound powder used in the step (A) include a Bacompound, a Ca compound, a Ti compound, a Zr compound, and a Mncompound. Examples of the Ba compound that can be used include bariumoxide, barium carbonate, barium oxalate, barium acetate, barium nitrate,barium titanate, barium zirconate, and barium zirconate titanate.

Examples of the Ca compound that can be used include calcium oxide,calcium carbonate, calcium oxalate, calcium acetate, calcium titanate,calcium zirconate, and calcium zirconate titanate.

Examples of the Ti compound that can be used include titanium oxide,barium titanate, barium zirconate titanate, and calcium titanate.

Examples of the Zr compound that can be used include zirconium oxide,barium zirconate, barium zirconate titanate, and calcium zirconate.

Examples of the Mn compound that can be used include manganesecarbonate, manganese oxide, manganese dioxide, manganese acetate, andtrimanganese tetraoxide.

An example of a method for preparing a slurry in the step (A) is asfollows. To a metal compound powder, a solvent having a weight 1.6 to1.7 greater than that of the metal compound powder is added, followed bymixing. Examples of the solvent that can be used include toluene,ethanol, a toluene-ethanol mixed solvent, n-butyl acetate, and water.The resulting mixture is mixed in a ball mill for 24 hours and a binderand a plasticizer are added thereto. Examples of the binder includepolyvinyl alcohol (PVA), polyvinyl butyral (PVB), and acrylic resins.When PVB is used as the binder, the binder is weighed so that thesolvent-to-PVB weight ratio is, for example, 88:12. Examples of theplasticizer include dioctyl sebacate, dioctyl phthalate, and dibutylphthalate. When dibutyl phthalate is used as the plasticizer, dibutylphthalate is weighed so that the weight thereof is the same as that ofthe binder. Then the resulting mixture is again mixed in a ball millovernight. The amounts of the solvent and the binder are adjusted sothat the viscosity of the slurry is 300 to 500 mPa·s.

The compact prepared in the step (B) is a sheet-shaped mixture of themetal compound powder, the binder, and the plasticizer. An example of amethod for preparing the compact in the step (B) is a sheet-formingmethod. A doctor blade method may be employed in the sheet-formingmethod. A doctor blade method is a method that includes applying slurryto the substrate by using a doctor blade and drying the applied slurryto form a sheet-shaped compact. A polyethylene terephthalate (PET) filmmay be used as the substrate, for example. A surface of a PET film onwhich the slurry is to be placed may be coated with a fluorine coatingin advance to facilitate separation of the compact. The slurry may bedried by air or hot air. The thickness of the compact is notparticularly limited and can be adjusted according to the thickness ofthe multilayered piezoelectric element. The thickness of the compact canbe increased by increasing the viscosity of the slurry, for example.

The method for making the electrodes, e.g., inner electrodes 505 andexternal electrodes 506 a and 506 b, in the step (C) is not particularlylimited. The electrodes may be formed by firing a metal paste, or by amethod such as sputtering, vapor deposition, or printing. The thicknessand pitch of the piezoelectric material layers 504 may be decreased todecrease the driving voltage. In such a case, a process of forming astack including precursors of the piezoelectric material layers 504 andinner electrodes 505 and then firing the resulting stack is selected.When this process is selected, the material of the inner electrodes 505is desirably a material that does not undergo changes in shapes ordeterioration of conductivity at a temperature needed to sinter thepiezoelectric material layers 504. Metals, such as Ag, Pd, Au, Cu, andNi, which have lower melting points and are less expensive than Pt, andalloys of such metals can be used to form electrodes such as innerelectrodes 505 and the external electrodes 506 a and 506 b.Alternatively, the external electrodes 506 a and 506 b may be formedafter the stack has been fired and, in such a case, may be composed ofAl or a carbon-based electrode material in addition to Ag, Pd, Cu, orNi.

The electrodes may be formed by a screen-printing method. Ascreen-printing method involves applying a metal paste onto a compact ona substrate through a screen plate by using a spatula. A screen mesh isformed in at least part of the screen plate. Thus, the metal paste isapplied to the compact only in the portions where the screen mesh isformed. The screen mesh in the screen plate may have a pattern formedtherein. The pattern is transferred to the compact by using the metalpaste so as to form a patterned electrode on the compact.

After the electrode is formed in the step (C) and the compact with theelectrode is separated from the substrate, one or a plurality of layersof the compacts are press-bonded. Examples of the press-bonding methodinclude uniaxial pressing, cold isostatic pressing, and hot isostaticpressing. The press-bonding may be conducted by hot isostatic pressingsince pressure can be evenly and isostatically applied to the compacts.Press bonding may be conducted under heating at a temperature near theglass transition temperature of the binder for satisfactory bonding. Twoor more of the compacts may be stacked and press-bonded until a desiredthickness is achieved. For example, 10 to 100 layers of compacts may bestacked and thermally press-bonded for 10 seconds to 10 minutes byapplying a pressure of 10 to 60 MPa in the stacking direction at 50° C.to 80° C. to form a multilayered structure. Alignment marks may beattached to the electrodes so that a plurality of layers of compacts canbe accurately aligned and stacked. Alternatively, accurate stacking maybe conducted by forming through holes for alignment in the compacts.

Although the sintering temperature of the compact in the step (D) is notparticularly limited, the sintering temperature may be a temperature atwhich compounds can react and sufficient crystal growth occurs. Thesintering temperature is preferably 1200° C. or more and 1550° C. orless and more preferably 1300° C. or more and 1480° C. or less to adjustthe grain diameter of the ceramic to be within a range of 1 μm to 10 μm.A multilayered piezoelectric element sintered within this temperaturerange exhibits a good piezoelectric property.

When a material mainly composed of Ni is used in the electrodes in thestep (C), the step (D) may be conducted in a furnace capable ofatmospheric firing. The binder is burned and removed at a temperature of200° C. to 600° C. in an ambient atmosphere and then the compact issintered at a temperature of 1200° C. to 1550° C. in a reducingatmosphere. A reducing atmosphere refers to an atmosphere mainlycomposed of a mixed gas of hydrogen (H₂) and nitrogen (N₂). The volumeratio of hydrogen to nitrogen may be H₂:N₂=1:99 to 10:90. The mixed gasmay contain oxygen. The oxygen concentration is 10⁻¹² Pa or more and10⁻⁴ Pa or less and preferably 10⁻⁸ Pa or more and 10⁻⁸ Pa or less. Theoxygen concentration can be measured with a zirconia-type oxygen sensor.Since Ni electrodes are used, the multilayered piezoelectric element canbe manufactured at a low cost. After firing in the reducing atmosphere,the compact may be cooled to 600° C. and the atmosphere may be changedto ambient atmosphere (oxidative atmosphere) to conduct an oxidationtreatment. After the compact is discharged from the firing furnace, aconductive paste is applied to a side surface of the compact in whichends of the inner electrodes are exposed, and dried to form an externalelectrode.

Liquid Discharge Head

A liquid discharge head according to an embodiment of the presentinvention includes at least a discharge port in communication with aliquid reservoir equipped with a vibrating unit that includes apiezoelectric element or multilayered piezoelectric element.

FIGS. 2A and 2B show a structure of a liquid discharge head according toone embodiment of the present invention. As shown in FIGS. 2A and 2B,the liquid discharge head includes a piezoelectric element 101. Thepiezoelectric element 101 includes a first electrode 1011, apiezoelectric material 1012, and a second electrode 1013. Thepiezoelectric material 1012 is patterned as needed as shown in FIG. 2B.

FIG. 2B is a schematic view of the liquid discharge head. The liquiddischarge head includes discharge ports 105, individual liquidreservoirs 102, connecting holes 106 connecting the individual liquidreservoirs 102 to the discharge ports 105, partitions 104, a commonliquid reservoir 107, a vibrating plate 103, and the piezoelectricelement 101. Although the piezoelectric element 101 illustrated in thedrawing has a rectangular shape, the shape may be any other shape, suchas an elliptical shape, a circular shape, or a rectangularparallelepiped shape. In general, the piezoelectric material 1012follows the shape of the individual liquid reservoir 102.

The piezoelectric element 101 and its nearby portion in the liquiddischarge head will now be described in detail with reference to FIG.2A. FIG. 2A is a cross-sectional view of the piezoelectric element shownin FIG. 2B taken in the width direction. Although the cross-sectionalshape of the piezoelectric element 101 in the drawing is rectangular,the cross-sectional shape may be any other shape, such as a trapezoidalshape or an inverted trapezoidal shape.

In the drawing, the first electrode 1011 is used as a lower electrodeand the second electrode 1013 is used as an upper electrode. However,the arrangement of the first electrode 1011 and the second electrode1013 is not limited to this. For example, the first electrode 1011 maybe used as the lower electrode or the upper electrode. The secondelectrode 1013 may be used as the upper electrode or the lowerelectrode. A buffer layer 108 may be present between the vibrating plate103 and the lower electrode. Such differences in naming are derived fromthe device production method and effects of the present invention can beachieved in either case.

The vibrating plate 103 of the liquid discharge head moves in verticaldirections as the piezoelectric material 1012 expands and contracts, andapplies pressure to liquid in the individual liquid reservoir 102. As aresult, liquid is ejected from the discharge port 105. The liquiddischarge head can be used in printers and for production of electronicdevices.

The thickness of the vibrating plate 103 is 1.0 μm or more and 15 μm orless and preferably 1.5 μm or more and 8 μm or less. The material forforming the vibrating plate 103 is not particularly limited but may besilicon. Silicon constituting the vibrating plate 103 may be doped withboron or phosphorus. The buffer layer 108 on the vibrating plate 103 andthe electrode on the buffer layer 108 may constitute part of thevibrating plate 103. The thickness of the buffer layer 108 is 5 nm ormore and 300 nm or less and preferably 10 nm or more and 200 nm or less.The size of the discharge port 105 is 5 μm or more and 40 μm or less interms of circular equivalent diameter. The shape of the discharge port105 may be circular, star-shaped, rectangular, or triangular, forexample.

Liquid Discharge Apparatus

A liquid discharge apparatus according to an embodiment of the presentinvention will now be described. The liquid discharge apparatus includesthe liquid discharge head described above.

An example of the liquid discharge apparatus is an ink jet recordingapparatus shown in FIGS. 6 and 7. FIG. 7 shows the state in which outercasings 882 to 885 and 887 are removed from a liquid discharge apparatus(ink jet recording apparatus) 881 shown in FIG. 6. The ink jet recordingapparatus 881 includes an automatic feeding unit 897 configured toautomatically feed a recording paper sheet, i.e., a recording medium,into a main body 896. The ink jet recording apparatus 881 also includesa transport unit 899 that guides the recording sheet fed from theautomatic feeding unit 897 to a particular recording position and to adischarge slot 898 from the recording position, a recording unit 891configured to conduct recording on the recording sheet transferred tothe recording position, and a recovery unit 890 configured to conduct arecovery process on the recording unit 891. The recording unit 891 has acarriage 892 that houses the liquid discharge head and moves on a railin a reciprocating manner.

When an electric signal is input to this ink jet recording apparatusfrom a computer, the carriage 892 moves on the rail and a drivingvoltage is applied to the electrodes sandwiching the piezoelectricmaterial so that the piezoelectric material undergoes deformation. Thisdeformation of the piezoelectric material pressurizes the individualliquid reservoir 102 via the vibrating plate 103 and causes ink to beejected from the discharge port 105, thereby conducting printing.

This liquid discharge apparatus can eject liquid uniformly at a highspeed and is small-sized. Although an example of a printer is describedabove, the liquid discharge apparatus may be used in industrial liquiddischarge apparatuses and drawing apparatuses configured to draw images,characters, etc., on media in addition to printing apparatus such asfacsimile machines, multifunction apparatuses, and ink jet recordingapparatuses.

Ultrasonic Motor

An ultrasonic motor according to an embodiment of the present inventionincludes at least a moving member that contacts a vibrating memberequipped with a piezoelectric material or multilayered piezoelectricelement.

FIGS. 3A and 3B are each a schematic view showing a structure of anultrasonic motor according to an embodiment of the present invention.FIG. 3A shows an ultrasonic motor that includes a piezoelectric elementhaving a single-layer structure. The ultrasonic motor includes avibrator 201, a rotor 202 pressure-contacting a sliding surface of thevibrator 201 due to the pressing force from a pressing spring (not shownin the drawing), and an output shaft 203 integral with the rotor 202.The vibrator 201 is constituted by, for example, a metal elastic ring2011, a piezoelectric element 2012, and an organic adhesive 2013(epoxy-based or cyanoacrylate-based adhesive, for example) that bondsthe piezoelectric element 2012 to the elastic ring 2011. Thepiezoelectric element 2012 is composed of a piezoelectric materialsandwiched between a first electrode and a second electrode which arenot shown in the drawing.

When two phases of AC voltage that are different from each other by π/2are applied to the piezoelectric element 2012, a bending traveling waveis generated in the vibrator 201 and each of the points on the slidingsurface of the vibrator 201 undergoes elliptic motion. When the rotor202 is in pressure-contact with the sliding surface of the vibrator 201,the vibrator 201 receives frictional force from the vibrator 201 androtates in a direction opposite to that of the bending travelling wave.An object to be driven, which is not shown in the drawing, is joined tothe output shaft 203 and is driven by the rotational force of the rotor202. When voltage is applied to the piezoelectric material, thepiezoelectric material expands and contracts due to the piezoelectrictransversal effect. When an elastic member such as a metal member is incontact with the piezoelectric element, the elastic member is bent asthe piezoelectric material expands and contracts. The ultrasonic motordescribed here is of a type that operates on this principle.

FIG. 3B shows an example of an ultrasonic motor including apiezoelectric element having a multilayered structure. A vibrator 204includes a cylindrical metal elastic member 2041 and a multilayeredpiezoelectric element 2042 provided in the metal elastic member 2041.The multilayered piezoelectric element 2042 is constituted by aplurality layers of piezoelectric materials although this is not shownin the drawing. A first electrode and a second electrode are disposed onouter surfaces of the stack and inner electrodes are provided inside thestack. The metal elastic member 2041 is bolted to sandwich themultilayered piezoelectric element 2042 to thereby constitute thevibrator 204.

Application of different phases of AC voltage to the multilayeredpiezoelectric element 2042 causes the vibrator 204 to excite twovibrations orthogonal to each other. These two vibrations are combinedinto a circular vibration that drives the tip of the vibrator 204. Anannular groove is formed in the upper part of the vibrator 204 toincrease the displacement of the vibration for drive.

A rotor 205 pressure-contacts the vibrator 204 due to a pressurizingspring 206 and receives frictional force for drive. The rotor 205 isrotatably supported on bearings.

Optical Apparatus

Next an optical apparatus according to an embodiment of the presentinvention is described. The optical apparatus includes an ultrasonicmotor in a drive unit.

FIGS. 8A and 8B are each a cross-sectional view of a related part of areplaceable lens barrel of a single-lens reflex camera, which is anexample of an imaging apparatus according to an embodiment of thepresent invention. FIG. 9 is an exploded perspective view of thereplaceable lens barrel.

Referring to FIGS. 8A, 8B, and 9, a fixed barrel 712, linear guidebarrel 713, and a front lens group barrel 714 are fixed to a mount 711detachable from and attachable to a camera. These are fixed members ofthe replaceable lens barrel.

A linear guide groove 713 a extending in an optical axis direction isformed in the linear guide barrel 713 to guide a focus lens 702. A camroller 717 a and a cam roller 717 b protruding in an outer radialdirection are fixed with a shaft screw 718 to a rear lens group barrel716 holding the focus lens 702. The cam roller 717 a is fitted in thelinear guide groove 713 a.

A cam ring 715 is rotatably fitted to the inner periphery of the linearguide barrel 713. Relative movements between the linear guide barrel 713and the cam ring 715 in the optical axis direction is inhibited since aroller 719 fixed to the cam ring 715 is fitted in an annular groove 713b of the linear guide barrel 713. A cam groove 715 a for the focus lens702 is formed in the cam ring 715. The cam roller 717 b is fitted in thecam groove 715 a.

A rotation transmitting ring 720 is provided on the outer peripheralside of the fixed barrel 712. The rotation transmitting ring 720 is heldby a ball race 727 so that it can rotate at a particular positionrelative to the fixed barrel 712. A roller 722 is rotatably held by ashaft 720 f extending in a radial manner from the rotation transmittingring 720, and a large-diameter portion 722 a of the roller 722 is incontact with a mount-side end surface 724 b of a manual focus ring 724.A small-diameter portion 722 b of the roller 722 is in contact with ajoint member 729. Six equally spaced rollers 722 are arranged on theouter periphery of the rotation transmitting ring 720 and each roller isconfigured to have the above-described relationship.

A low-friction sheet (washer member) 733 is arranged on the inner radialportion of the manual focus ring 724. The low-friction sheet 733 isinterposed between a mount-side end surface 712 a of the fixed barrel712 and a front-side end surface 724 a of the manual focus ring 724. Theouter radial surface of the low-friction sheet 733 has a ring shape andis fitted in an inner radial portion 724 c of the manual focus ring 724.The inner radial portion 724 c of the manual focus ring 724 is fitted inan outer radial portion 712 b of the fixed barrel 712. The low-frictionsheet 733 reduces the friction in a rotary ring mechanism in which themanual focus ring 724 is rotated relative to the fixed barrel 712 aboutthe optical axis.

The large-diameter portion 722 a of the roller 722 and a mount-side endsurface 724 b of the manual focus ring 724 contact each other underpressure by being pressed by a wave washer 726 that presses anultrasonic motor 725 toward the front side of the lens. The force fromthe wave washer 726 pressing the ultrasonic motor 725 toward the frontside of the lens also causes the small-diameter portion 722 b of theroller 722 and the joint member 729 to contact each other under anadequate degree of pressure. The wave washer 726 is confined from movingin the mount direction by a washer 732 bayonet-mounted to the fixedbarrel 712. The spring force (urging force) generated by the wave washer726 is transmitted to the ultrasonic motor 725 and to the roller 722 andserves as thrusting force of the manual focus ring 724 against themount-side end surface 712 a of the fixed barrel 712. In other words,the manual focus ring 724 is assembled while being urged against themount-side end surface 712 a of the fixed barrel 712 via thelow-friction sheet 733.

Accordingly, when the ultrasonic motor 725 is driven and rotated withrespect to the fixed barrel 712 by a controlling unit not shown in thedrawing, the roller 722 rotates about the center of the shaft 720 fbecause the joint member 729 makes frictional contact with thesmall-diameter portion 722 b of the roller 722. As the roller 722rotates about the shaft 720 f, the rotation transmitting ring 720 isrotated about the optical axis (automatic focusing operation).

When rotation force about the optical axis is applied to the manualfocus ring 724 from a manual operation input unit not shown in thedrawing, the roller 722 rotates about the shaft 720 f since themount-side end surface 724 b of the manual focus ring 724 is inpressure-contact with the large-diameter portion 722 a of the roller722. As the large-diameter portion 722 a of the roller 722 rotates aboutthe shaft 720 f, the rotation transmitting ring 720 is rotated about theoptical axis. The ultrasonic motor 725 at this time is prevented fromrotating due to the frictional retention force of a rotor 725 c and astator 725 b (manual focusing operation).

Two focus keys 728 are installed in the rotation transmitting ring 720at positions opposite to each other and fitted in notches 715 b at thefront tip of the cam ring 715. When automatic focusing operation ormanual focusing operation is conducted and the rotation transmittingring 720 is rotated about the optical axis, the rotation force istransmitted to the cam ring 715 via the focus keys 728. When the camring 715 is rotated about the optical axis, a rear lens group barrel 716inhibited from rotating due to the cam roller 717 a and the linear guidegroove 713 a moves back and forth along the cam groove 715 a in the camring 715 by the cam roller 717 b. This drives the focus lens 702 andfocusing operation is conducted.

Although a replaceable lens barrel of a single-lens reflex camera hasbeen described as an example of the optical apparatus of the presentinvention, the range of the optical apparatus is not limited to this.The optical apparatus may be any type of camera such as a compactcamera, an electronic still camera, or the like, or may be a portableinformation terminal equipped with a camera. An optical apparatus havingan ultrasonic motor in a driver unit is also within the range of thepresent invention.

Electronic Apparatus

An electronic apparatus according to an embodiment of the presentinvention will now be described. An electronic apparatus according to anembodiment includes a piezoelectric acoustic component equipped with apiezoelectric element or multilayered piezoelectric element. Thepiezoelectric acoustic component may be a speaker, a microphone, asurface acoustic wave (SAW) device, or the like.

FIG. 10 is a perspective view of a digital camera, which is an exampleof the electronic apparatus according to the present invention, asviewed from the front of a main body 931. An optical device 901, amicrophone 914, a strobe light unit 909, and an auxiliary light unit 916are installed in the front face of the main body 931. Since themicrophone 914 is assembled inside the main body, it is indicated by abroken line. A hole for collecting sound from outside is formed at thefront of the microphone 914.

A power button 933, a speaker 912, a zoom lever 932, and a releasebutton 908 for executing focusing operation are installed in the uppersurface of the main body 931. The speaker 912 is built inside the mainbody 931 and is indicated by a broken line. Holes for outputting soundare formed at the front of the speaker 912.

The piezoelectric acoustic component is used in at least one of themicrophone 914, speaker 912, and a SAW device.

Although a digital camera is described as one example of the electronicapparatus of the present invention, the electronic apparatus is notlimited to this and may be any electronic apparatus equipped with apiezoelectric acoustic component, such as a sound-reproducing apparatus,a sound-recording apparatus, a cellular phone, and an informationterminal.

As has been described above, the embodiments of the piezoelectricelement and the multilayered piezoelectric element described above aresuitable for use in a liquid discharge head, a liquid dischargeapparatus, an ultrasonic motor, an optical apparatus, and an electronicapparatus.

When the piezoelectric element or the multilayered piezoelectric elementof the present invention is used, a liquid discharge head that has anozzle density and discharge force comparable or superior to a liquiddischarge head that includes a lead-containing piezoelectric element canbe provided. A liquid discharge apparatus equipped with a liquiddischarge head according to an embodiment of the present invention canexhibit discharge force and discharge accuracy comparable or superior toa liquid discharge apparatus that uses a liquid discharge head includinga lead-containing piezoelectric element.

An ultrasonic motor that uses the piezoelectric element or themultilayered piezoelectric element according to an embodiment of thepresent invention exhibits driving force and durability comparable orsuperior to an ultrasonic motor that uses a lead-containingpiezoelectric element. An optical apparatus that uses the ultrasonicmotor can exhibit durability and operation accuracy comparable orsuperior to an optical apparatus that uses an ultrasonic motor thatincludes a lead-containing piezoelectric element. An electronicapparatus that uses a piezoelectric acoustic component equipped with apiezoelectric element or multilayered piezoelectric element according toan embodiment of the present invention exhibits a sound-generatingproperty comparable or superior to an electronic apparatus that includesa lead-containing piezoelectric element.

EXAMPLES

The present invention will now be described in more detail by usingexamples which do not limit the scope of the invention.

A piezoelectric ceramic for use in a piezoelectric element was prepared.

Production Example 1

Barium titanate having an average particle diameter of 100 nm (BT-01produced by Sakai Chemical Industry Co., Ltd.), calcium titanate havingan average particle diameter of 300 nm (CT-03 produced by Sakai ChemicalIndustry Co., Ltd.), and calcium zirconate having an average particlediameter of 300 nm (CZ-03 produced by Sakai Chemical Industry Co., Ltd.)were weighed so that the ratio was 90.5:6.5:3.0 on a molar basis. Inorder to adjust the molar ratio a of Ba and Ca in A sites to Ti and Zrin B sites, 0.008 mol of barium oxalate was added. The resulting mixturewas dry-mixed in a ball mill for 24 hours. To the resulting mixture,0.08 parts by weight of manganese(II) acetate on a manganese metal basisand 3 parts by weight of a PVA binder relative to the mixed powder werecaused to adhere to surfaces of the mixed powder by using a spray dryerin order to granulate the mixed powder.

The granulated powder was charged in a mold and pressed under 200 MPa offorming pressure with a press-molding machine to prepare a disk-shapedcompact. The compact may be further pressed by using a cold isostaticpress-molding machine.

The compact was placed in an electric furnace and sintered in an airatmosphere for a total of 24 hours during which a maximum temperature of1400° C. was retained for 5 hours.

The average circular equivalent diameter and the relative density ofcrystal grains constituting the resulting ceramic were evaluated. Theaverage circular equivalent diameter was 6.2 μm and the relative densitywas 94.9%. A polarizing microscope was mainly used to observe crystalgrains. The diameter of small crystal grains was determined by using ascanning electron microscope (SEM). The average circular equivalentdiameter was calculated on the basis of the observation results. Therelative density was evaluated by the Archimedean method.

The ceramic was polished to a thickness of 0.5 mm and the crystalstructure of the ceramic was analyzed by X-ray diffraction. As a result,only peaks attributable to a perovskite-type structure were observed.

The composition of the ceramic was analyzed by X-ray fluorescenceanalysis. The results found that 0.08 parts by weight of Mn wasincorporated in a composition expressed by a chemical formula,(Ba_(0.905)Ca_(0.095))_(1.002)(Ti_(0.97)Zr_(0.03))O₃. This means thatthe composition prepared by weighing matches the composition aftersintering. The contents of the elements other than Ba, Ca, Ti, Zr, andMn were below detection limits, i.e., less than 0.1 parts by weight.

The crystal grains were observed again. However, the average circularequivalent diameter was not much different between before and afterpolishing.

Production Examples 2 to 52, 72, and 73

Barium titanate having an average particle diameter of 100 nm (BT-01produced by Sakai Chemical Industry Co., Ltd.), calcium titanate havingan average particle diameter of 300 nm (CT-03 produced by Sakai ChemicalIndustry Co., Ltd.), and calcium zirconate having an average particlediameter of 300 nm (CZ-03 produced by Sakai Chemical Industry Co., Ltd.)were weighed so that the ratio on a molar basis was as shown in Tables1-1 and 1-2. In order to adjust the molar ratio a of Ba and Ca in Asites to Ti and Zr in B sites, barium oxalate in an amount indicated inTables 1-1 and 1-2 was weighed. These powders were dry-mixed in a ballmill for 24 hours. In Example 48, 0.8 parts by weight of Si on an oxidebasis was added as an auxiliary component. In Example 52, a total of 1.0parts by weight of Si and Cu on an oxide basis were added as auxiliarycomponents. To the resulting mixture, manganese(II) acetate in an amounton a manganese metal basis shown in Tables 1-1 and 1-2 and 3 parts byweight of a PVA binder relative to the mixed powder were caused toadhere to surfaces of the mixed powder by using a spray dryer in orderto granulate the mixed powder.

The granulated powder was charged in a mold and pressed under 200 MPa offorming pressure with a press-molding machine to prepare a disk-shapedcompact. The compact may be further pressed by using a cold isostaticpress-molding machine.

The compact was placed in an electric furnace and sintered in an airatmosphere for a total of 24 hours, during which a maximum temperatureof 1350° C. to 1480° C. was retained for 5 hours. The maximumtemperature was increased as the amount of Ca was increased.

The average circular equivalent diameter and the relative density ofcrystal grains constituting the resulting ceramic were evaluated. Theresults are shown in Tables 2-1 and 2-2. A polarizing microscope wasmainly used to observe crystal grains. The diameter of small crystalgrains was determined by using a scanning electron microscope (SEM). Theaverage circular equivalent diameter was calculated on the basis of theobservation results. The relative density was evaluated by theArchimedean method.

The ceramic was polished to a thickness of 0.5 mm and the crystalstructure of the ceramic was analyzed by X-ray diffraction. As a result,only peaks attributable to a perovskite-type structure were observed inall samples.

The composition of the ceramic was analyzed by X-ray fluorescenceanalysis. The results are shown in Tables 3-1 and 3-2. In the table,auxiliary components refer to elements other than Ba, Ca, Ti, Zr, and Mnand 0 means that the content was below the detection limit. As a result,it was found that the composition prepared by weighing matched thecomposition after sintering in all samples.

The crystal grains were observed again. However, the size and conditionsof the crystal grains were not much different between after sinteringand after polishing.

Production Examples 53 to 71 for Comparison

The same raw material powders as those in Examples 1 to 52, 72, and 73and barium zirconate having an average particle diameter of 300 nm(produced by Nippon Chemical Industrial Co., Ltd.) were weighed so thatthe molar ratio was as shown in Tables 1-1 and 1-2. Each mixture wasdry-mixed in a ball mill for 24 hours. In Production Example 65, Y and Vin a total amount of 2.1 parts by weight on an oxide basis were added.To the resulting mixture, manganese(II) acetate in an amount on amanganese metal basis indicated in Tables 1-1 and 1-2 and 3 parts byweight of a PVA binder relative to the mixed powder were caused toadhere to surfaces of mixed powder by using a spray dryer in order togranulate the mixed powder.

A ceramic was prepared under the same conditions as in Examples 2 to 52,72, and 73 by using each of the resulting granulated powders. Theaverage circular equivalent diameter and the relative density of crystalgrains constituting the ceramic were evaluated. The results are shown inTables 2-1 and 2-2. Evaluation of the crystal grains and the relativedensity was conducted as in Examples 1 to 52, 72, and 73.

Each resulting ceramic was polished to a thickness of 0.5 mm and thecrystal structure of the ceramic was analyzed by X-ray diffraction. As aresult, only peaks attributable to a perovskite-type structure wereobserved in all samples.

The composition of the ceramic was analyzed by X-ray fluorescenceanalysis. The results are shown in Tables 3-1 and 3-2. As a result, itwas found that the composition prepared by weighing matched thecomposition after sintering in all samples.

The relationship between x and y in the piezoelectric materials ofProduction Examples 1 to 73 is shown in the graph of FIG. 1. In thefigure, the range marked by a broken line indicates the range of x and yof general formula (1) representing the perovskite-type metal oxidedescribed in the embodiment.

TABLE 1-1 Mn Auxiliary content components BaTiO₃ CaTiO₃ CaZrO₃ BaZrO₃BaC₂O₄ [parts by [parts by [mol] [mol] [mol] [mol] [mol] weight] weight]Production Example 1 90.5 6.5 3.0 0.0 0.008 0.08 0.0 Production Example2 95.0 0.0 5.0 0.0 0.009 0.10 0.0 Production Example 3 98.0 0.0 2.0 0.00.008 0.10 0.0 Production Example 4 90.5 3.5 6.0 0.0 0.006 0.08 0.0Production Example 5 90.5 0.0 9.5 0.0 0.006 0.06 0.0 Production Example6 87.5 10.5 2.0 0.0 0.009 0.08 0.0 Production Example 7 87.5 7.5 5.0 0.00.006 0.06 0.0 Production Example 8 87.5 7.0 5.5 0.0 0.005 0.06 0.0Production Example 9 87.5 3.5 9.0 0.0 0.005 0.06 0.0 Production Example10 86.0 6.5 7.5 0.0 0.006 0.02 0.0 Production Example 11 86.0 6.5 7.50.0 0.003 0.02 0.0 Production Example 12 86.0 6.5 7.5 0.0 0.008 0.07 0.0Production Example 13 86.0 6.5 7.5 0.0 0.005 0.07 0.0 Production Example14 86.0 6.5 7.5 0.0 0.007 0.08 0.0 Production Example 15 84.5 13.5 2.00.0 0.014 0.15 0.0 Production Example 16 84.5 12.0 3.5 0.0 0.016 0.180.0 Production Example 17 84.5 11.4 4.1 0.0 0.014 0.18 0.0 ProductionExample 18 84.5 9.0 6.5 0.0 0.003 0.02 0.0 Production Example 19 84.59.0 6.5 0.0 0.006 0.06 0.0 Production Example 20 84.5 9.0 6.5 0.0 0.0090.06 0.0 Production Example 21 84.5 9.0 6.5 0.0 0.008 0.10 0.0Production Example 22 84.5 9.0 6.5 0.0 0.012 0.10 0.0 Production Example23 84.5 8.6 6.9 0.0 0.014 0.18 0.0 Production Example 24 82.5 14.5 3.00.0 0.013 0.15 0.0 Production Example 25 82.5 12.0 5.5 0.0 0.009 0.060.0 Production Example 26 82.5 8.5 9.0 0.0 0.014 0.10 0.0 ProductionExample 27 81.3 12.7 6.0 0.0 0.009 0.12 0.0 Production Example 28 81.312.7 6.0 0.0 0.017 0.18 0.0 Production Example 29 81.3 12.7 6.0 0.00.013 0.18 0.0 Production Example 30 81.3 12.7 6.0 0.0 0.021 0.24 0.0Production Example 31 81.3 12.7 6.0 0.0 0.015 0.24 0.0 ProductionExample 32 81.3 12.7 6.0 0.0 0.023 0.30 0.0 Production Example 33 80.016.5 3.5 0.0 0.017 0.20 0.0 Production Example 34 80.0 14.5 5.5 0.00.017 0.22 0.0 Production Example 35 80.0 13.0 7.0 0.0 0.019 0.24 0.0Production Example 36 80.0 11.0 9.0 0.0 0.019 0.26 0.0 ProductionExample 37 78.0 19.0 3.0 0.0 0.017 0.22 0.0 Production Example 38 78.015.5 6.5 0.0 0.014 0.15 0.0 Production Example 39 78.0 15.5 6.5 0.00.011 0.15 0.0 Production Example 40 78.0 15.5 6.5 0.0 0.018 0.20 0.0

TABLE 1-2 Auxiliary Mn content components BaTiO₃ CaTiO₃ CaZrO₃ BaZrO₃BaC₂O₄ [parts by [parts by [mol] [mol] [mol] [mol] [mol] weight] weight]Production Example 41 78.0 15.5 6.5 0.0 0.017 0.20 0.0 ProductionExample 42 78.0 15.5 6.5 0.0 0.018 0.25 0.0 Production Example 43 78.014.0 8.0 0.0 0.020 0.28 0.0 Production Example 44 74.0 24.0 2.0 0.00.018 0.22 0.0 Production Example 45 74.0 21.5 4.5 0.0 0.017 0.24 0.0Production Example 46 74.0 19.5 6.5 0.0 0.017 0.26 0.0 ProductionExample 47 74.0 19.0 7.0 0.0 0.019 0.28 0.0 Production Example 48 70.028.0 2.0 0.0 0.018 0.26 0.8 Production Example 49 70.0 25.9 4.1 0.00.021 0.26 0.0 Production Example 50 70.0 25.0 5.0 0.0 0.020 0.28 0.0Production Example 51 70.0 23.1 6.9 0.0 0.024 0.30 0.0 ProductionExample 52 70.0 20.5 9.5 0.0 0.023 0.30 1.0 Production Example 53 98.00.0 0.0 2.0 0.004 0.00 0.0 Production Example 54 90.5 5.0 0.0 4.5 0.0050.02 0.0 Production Example 55 87.5 12.5 0.0 0.0 0.009 0.08 0.0Production Example 56 72.5 12.5 0.0 15.0 0.005 0.06 0.0 ProductionExample 57 84.5 15.5 0.0 0.0 0.014 0.15 0.0 Production Example 58 69.515.5 0.0 15.0 0.014 0.18 0.0 Production Example 59 78.0 22.0 0.0 0.00.017 0.22 0.0 Production Example 60 63.0 22.0 0.0 15.0 0.021 0.28 0.0Production Example 61 70.0 30.0 0.0 0.0 0.018 0.26 0.0 ProductionExample 62 55.0 30.0 0.0 15.0 0.000 0.30 0.0 Production Example 63 68.025.5 6.5 0.0 0.011 0.15 0.0 Production Example 64 81.3 12.7 6.0 0.00.000 0.18 0.0 Production Example 65 78.0 15.5 6.5 0.0 0.014 0.15 2.1Production Example 66 81.3 12.7 6.0 0.0 0.040 0.18 0.0 ProductionExample 67 86.0 6.5 7.5 0.0 0.005 0.00 0.0 Production Example 68 81.312.7 6.0 0.0 0.029 0.45 0.0 Production Example 69 78.0 15.5 6.5 0.00.014 0.15 0.0 Production Example 70 78.0 15.5 6.5 0.0 0.014 0.15 0.0Production Example 71 78.0 15.5 6.5 0.0 0.014 0.15 0.0 ProductionExample 72 81.3 12.7 6.0 0.0 0.029 0.40 0.0 Production Example 73 84.010.1 5.9 0.0 0.028 0.40 0.0

TABLE 2-1 Average circular Relative equivalent density diameter [μm] [%]Example 1 Production Example 1 6.2 94.9 Example 2 Production Example 26.7 94.0 Example 3 Production Example 3 6.0 94.1 Example 4 ProductionExample 4 7.8 94.7 Example 5 Production Example 5 6.6 94.8 Example 6Production Example 6 2.7 94.9 Example 7 Production Example 7 6.1 94.8Example 8 Production Example 8 7.7 94.9 Example 9 Production Example 96.5 95.3 Example 10 Production Example 10 7.8 91.8 Example 11 ProductionExample 11 7.1 94.5 Example 12 Production Example 12 8.6 95.1 Example 13Production Example 13 6.9 95.3 Example 14 Production Example 14 6.1 94.7Example 15 Production Example 15 5.8 96.8 Example 16 Production Example16 2.4 94.4 Example 17 Production Example 17 10.4 94.6 Example 18Production Example 18 6.7 92.7 Example 19 Production Example 19 6.8 93.8Example 20 Production Example 20 9.6 93.9 Example 21 Production Example21 5.5 94.7 Example 22 Production Example 22 10.8 93.8 Example 23Production Example 23 5.7 94.8 Example 24 Production Example 24 5.3 94.9Example 25 Production Example 25 4.3 94.4 Example 26 Production Example26 7.1 94.3 Example 27 Production Example 27 6.7 94.2 Example 28Production Example 28 8.8 95.1 Example 29 Production Example 29 5.5 97.5Example 30 Production Example 30 3.1 95.6 Example 31 Production Example31 3.2 97.1 Example 32 Production Example 32 4.2 98.0 Example 33Production Example 33 2.1 95.6 Example 34 Production Example 34 5.6 98.7Example 35 Production Example 35 5.4 98.5 Example 36 Production Example36 6.2 97.0 Example 37 Production Example 37 4.1 95.5 Example 38Production Example 38 4.0 94.9 Example 39 Production Example 39 3.9 96.0Example 40 Production Example 40 5.2 96.2

TABLE 2-2 Average circular equivalent Relative diameter density [μm] [%]Example 41 Production Example 41 6.3 97.1 Example 42 Production Example42 4.9 97.4 Example 43 Production Example 43 5.4 96.4 Example 44Production Example 44 5.7 95.9 Example 45 Production Example 45 6.1 96.2Example 46 Production Example 46 6.5 95.6 Example 47 Production Example47 6.8 96.8 Example 48 Production Example 48 2.4 96.3 Example 49Production Example 49 2.1 95.7 Example 50 Production Example 50 3.9 96.6Example 51 Production Example 51 4.6 96.5 Example 52 Production Example52 4.8 96.0 Comparative Example 1 Production Example 53 6.7 93.1Comparative Example 2 Production Example 54 6.1 93.2 Comparative Example3 Production Example 55 2.1 93.7 Comparative Example 4 ProductionExample 56 7.9 93.6 Comparative Example 5 Production Example 57 2.3 93.6Comparative Example 6 Production Example 58 7.8 93.8 Comparative Example7 Production Example 59 1.7 94.1 Comparative Example 8 ProductionExample 60 7.6 93.7 Comparative Example 9 Production Example 61 1.9 93.4Comparative Example 10 Production Example 62 7.5 93.2 ComparativeExample 11 Production Example 63 0.7 93.1 Comparative Example 12Production Example 64 32.2 96.1 Comparative Example 13 ProductionExample 65 1.8 96.1 Comparative Example 14 Production Example 66 0.593.8 Comparative Example 15 Production Example 67 7.9 93.0 ComparativeExample 16 Production Example 68 1.2 93.1 Comparative Example 17Production Example 69 0.8 94.2 Comparative Example 18 Production Example70 182.0 97.6 Comparative Example 19 Production Example 71 9.1 89.0Example 53 Production Example 72 8.1 98.5 Example 54 Production Example73 7.4 98.8

TABLE 3-1 Auxiliary Mn content components [parts by [parts by x y aweight] weight] Example 1 Production Example 1 0.095 0.030 1.002 0.080.0 Example 2 Production Example 2 0.050 0.050 1.003 0.10 0.0 Example 3Production Example 3 0.020 0.020 1.002 0.10 0.0 Example 4 ProductionExample 4 0.095 0.060 1.001 0.08 0.0 Example 5 Production Example 50.095 0.095 1.002 0.06 0.0 Example 6 Production Example 6 0.125 0.0201.003 0.08 0.0 Example 7 Production Example 7 0.125 0.050 1.001 0.06 0.0Example 8 Production Example 8 0.125 0.055 1.000 0.06 0.0 Example 9Production Example 9 0.125 0.090 1.000 0.06 0.0 Example 10 ProductionExample 10 0.140 0.075 1.003 0.02 0.0 Example 11 Production Example 110.140 0.075 1.000 0.02 0.0 Example 12 Production Example 12 0.140 0.0751.003 0.07 0.0 Example 13 Production Example 13 0.140 0.075 1.000 0.070.0 Example 14 Production Example 14 0.140 0.075 1.001 0.08 0.0 Example15 Production Example 15 0.155 0.020 1.005 0.15 0.0 Example 16Production Example 16 0.155 0.035 1.006 0.18 0.0 Example 17 ProductionExample 17 0.155 0.041 1.004 0.18 0.0 Example 18 Production Example 180.155 0.065 1.000 0.02 0.0 Example 19 Production Example 19 0.155 0.0651.001 0.06 0.0 Example 20 Production Example 20 0.155 0.065 1.004 0.060.0 Example 21 Production Example 21 0.155 0.065 1.001 0.10 0.0 Example22 Production Example 22 0.155 0.065 1.005 0.10 0.0 Example 23Production Example 23 0.155 0.069 1.004 0.18 0.0 Example 24 ProductionExample 24 0.175 0.030 1.004 0.15 0.0 Example 25 Production Example 250.175 0.055 1.004 0.06 0.0 Example 26 Production Example 26 0.175 0.0901.007 0.10 0.0 Example 27 Production Example 27 0.187 0.060 1.001 0.120.0 Example 28 Production Example 28 0.187 0.060 1.007 0.18 0.0 Example29 Production Example 29 0.187 0.060 1.003 0.18 0.0 Example 30Production Example 30 0.187 0.060 1.009 0.24 0.0 Example 31 ProductionExample 31 0.187 0.060 1.003 0.24 0.0 Example 32 Production Example 320.187 0.060 1.008 0.30 0.0 Example 33 Production Example 33 0.200 0.0351.006 0.20 0.0 Example 34 Production Example 34 0.200 0.055 1.005 0.220.0 Example 35 Production Example 35 0.200 0.070 1.007 0.24 0.0 Example36 Production Example 36 0.200 0.090 1.006 0.26 0.0 Example 37Production Example 37 0.220 0.030 1.005 0.22 0.0 Example 38 ProductionExample 38 0.220 0.065 1.005 0.15 0.0 Example 39 Production Example 390.220 0.065 1.002 0.15 0.0 Example 40 Production Example 40 0.220 0.0651.007 0.20 0.0

TABLE 3-2 Mn Auxiliary content components [parts by [parts by x y aweight] weight] Example 41 Production Example 41 0.220 0.065 1.006 0.200.0 Example 42 Production Example 42 0.220 0.065 1.005 0.25 0.0 Example43 Production Example 43 0.220 0.080 1.006 0.28 0.0 Example 44Production Example 44 0.260 0.020 1.006 0.22 0.0 Example 45 ProductionExample 45 0.260 0.045 1.004 0.24 0.0 Example 46 Production Example 460.260 0.065 1.004 0.26 0.0 Example 47 Production Example 47 0.260 0.0701.005 0.28 0.0 Example 48 Production Example 48 0.300 0.020 1.004 0.260.0 Example 49 Production Example 49 0.300 0.041 1.007 0.26 0.8 Example50 Production Example 50 0.300 0.050 1.006 0.28 0.0 Example 51Production Example 51 0.300 0.069 1.009 0.30 0.0 Example 52 ProductionExample 52 0.300 0.095 1.008 0.30 1.0 Comparative Example 1 ProductionExample 53 0.000 0.020 1.002 0.00 0.0 Comparative Example 2 ProductionExample 54 0.050 0.095 1.002 0.02 0.0 Comparative Example 3 ProductionExample 55 0.125 0.000 1.003 0.08 0.0 Comparative Example 4 ProductionExample 56 0.125 0.150 1.000 0.06 0.0 Comparative Example 5 ProductionExample 57 0.155 0.000 1.005 0.15 0.0 Comparative Example 6 ProductionExample 58 0.155 0.150 1.004 0.18 0.0 Comparative Example 7 ProductionExample 59 0.220 0.000 1.005 0.22 0.0 Comparative Example 8 ProductionExample 60 0.220 0.150 1.006 0.28 0.0 Comparative Example 9 ProductionExample 61 0.300 0.000 1.004 0.26 0.0 Comparative Example 10 ProductionExample 62 0.300 0.150 1.008 0.30 0.0 Comparative Example 11 ProductionExample 63 0.320 0.065 1.002 0.15 0.0 Comparative Example 12 ProductionExample 64 0.187 0.060 0.980 0.18 0.0 Comparative Example 13 ProductionExample 65 0.220 0.065 1.005 0.15 2.1 Comparative Example 14 ProductionExample 66 0.187 0.060 1.030 0.18 0.0 Comparative Example 15 ProductionExample 67 0.140 0.075 1.003 0.00 0.0 Comparative Example 16 ProductionExample 68 0.187 0.060 1.008 0.45 0.0 Comparative Example 17 ProductionExample 69 0.220 0.065 1.005 0.15 0.0 Comparative Example 18 ProductionExample 70 0.220 0.065 1.005 0.15 0.0 Comparative Example 19 ProductionExample 71 0.220 0.065 1.005 0.15 0.0 Example 53 Production Example 720.187 0.060 1.010 0.40 0.0 Example 54 Production Example 73 0.160 0.0591.009 0.40 0.0

Preparation of Piezoelectric Element and Evaluation of StaticCharacteristics Examples 1 to 54

Piezoelectric elements of Example 1 to 54 were fabricated by usingceramics of Production Examples 1 to 52, 72, and 73.

A gold electrode having a thickness of 400 nm was formed on both sidesof the disk-shaped ceramic described above by DC sputtering. A titaniumfilm functioning as an adhesive layer and having a thickness of 30 nmwas formed between the electrode and the ceramic. The ceramic with theelectrodes was cut into a strip-shaped piezoelectric element 10 mm×2.5mm×0.5 mm in size.

The piezoelectric element was placed on a hot plate having a surfaceadjusted to 60° C. to 100° C. and a 1 kV/mm electric field was appliedto the piezoelectric element for 30 minutes to conduct a polarizationtreatment.

The static characteristics of the piezoelectric element, i.e., the Curietemperature, the dielectric loss, the piezoelectric constant d₃₁, andthe mechanical quality factor (Qm), of the polarized piezoelectricelement were evaluated. The results are shown in Tables 4-1 and 4-2. Themechanical quality factor is indicated in Table 6. The Curie temperaturewas determined from the temperature at which the dielectric constantmeasured under application of a 1 kHz micro AC field while varyingmeasurement temperature was maximal. The dielectric loss was alsomeasured simultaneously. The piezoelectric constant d₃₁ was determinedby a resonance-anti-resonance method and the absolute value is indicatedin the table.

Tables 4-1 and 4-2 also shows the amounts of Ba and Ca on a molar basisand the Ti/Zr/Mn molar ratio. In the table, “X” indicates thatevaluation could not be conducted.

TABLE 4-1 Curie Piezoelectric temperature constant Dielectric (Ba + Ca)/[° C.] |d₃₁|[pC/N] loss [%] (Ti + Zr + Mn) Example 1 Production Example1 120 104 0.3 0.999 Example 2 Production Example 2 115 134 0.3 0.999Example 3 Production Example 3 124 125 0.3 0.998 Example 4 ProductionExample 4 110 115 0.3 0.998 Example 5 Production Example 5 85 130 0.31.000 Example 6 Production Example 6 125 92 0.3 1.000 Example 7Production Example 7 114 100 0.3 0.999 Example 8 Production Example 8112 104 0.3 0.998 Example 9 Production Example 9 88 120 0.3 0.998Example 10 Production Example 10 100 106 0.4 1.002 Example 11 ProductionExample 11 100 111 0.3 0.999 Example 12 Production Example 12 100 1000.3 1.000 Example 13 Production Example 13 100 107 0.2 0.997 Example 14Production Example 14 100 100 0.3 0.998 Example 15 Production Example 15123 95 0.1 0.999 Example 16 Production Example 16 118 77 0.2 0.999Example 17 Production Example 17 117 82 0.2 0.997 Example 18 ProductionExample 18 107 111 0.4 0.999 Example 19 Production Example 19 106 1000.3 0.999 Example 20 Production Example 20 106 91 0.3 1.002 Example 21Production Example 21 106 90 0.2 0.997 Example 22 Production Example 22106 84 0.3 1.001 Example 23 Production Example 23 102 88 0.2 0.997Example 24 Production Example 24 121 91 0.2 0.998 Example 25 ProductionExample 25 112 84 0.3 1.002 Example 26 Production Example 26 88 116 0.31.003 Example 27 Production Example 27 106 85 0.3 0.996 Example 28Production Example 28 106 79 0.2 1.000 Example 29 Production Example 29106 85 0.1 0.996 Example 30 Production Example 30 106 77 0.2 0.999Example 31 Production Example 31 106 81 0.1 0.993 Example 32 ProductionExample 32 106 75 0.1 0.996 Example 33 Production Example 33 118 67 0.20.998 Example 34 Production Example 34 112 80 0.1 0.996 Example 35Production Example 35 102 82 0.1 0.998 Example 36 Production Example 3690 84 0.1 0.996 Example 37 Production Example 37 120 64 0.2 0.996Example 38 Production Example 38 105 77 0.2 0.999 Example 39 ProductionExample 39 105 81 0.1 0.996 Example 40 Production Example 40 105 75 0.10.999

TABLE 4-2 Curie Piezoelectric temperature constant Dielectric (Ba + Ca)/[° C.] |d₃₁|[pC/N] loss [%] (Ti + Zr + Mn) Example 41 Production Example41 106 77 0.1 0.998 Example 42 Production Example 42 105 73 0.1 0.995Example 43 Production Example 43 92 91 0.1 0.995 Example 44 ProductionExample 44 124 65 0.2 0.998 Example 45 Production Example 45 115 70 0.20.995 Example 46 Production Example 46 106 74 0.1 0.994 Example 47Production Example 47 100 82 0.1 0.994 Example 48 Production Example 48126 55 0.1 0.994 Example 49 Production Example 49 118 58 0.1 0.997Example 50 Production Example 50 116 61 0.1 0.995 Example 51 ProductionExample 51 100 68 0.1 0.998 Example 52 Production Example 52 88 71 0.10.997 Comparative Example 1 Production Example 53 124 125 0.9 1.002Comparative Example 2 Production Example 54 88 130 0.5 0.999 ComparativeExample 3 Production Example 55 130 41 0.4 1.000 Comparative Example 4Production Example 56 60 140 0.4 0.998 Comparative Example 5 ProductionExample 57 130 38 0.4 0.999 Comparative Example 6 Production Example 5860 135 0.4 0.997 Comparative Example 7 Production Example 59 130 30 0.30.997 Comparative Example 8 Production Example 60 60 110 0.4 0.995Comparative Example 9 Production Example 61 128 35 0.3 0.994 ComparativeExample 10 Production Example 62 60 99 0.4 0.997 Comparative Example 11Production Example 63 106 21 0.9 0.996 Comparative Example 12 ProductionExample 64 110 x x 0.973 Comparative Example 13 Production Example 65106 36 0.2 0.999 Comparative Example 14 Production Example 66 110 20 0.91.023 Comparative Example 15 Production Example 67 95 130 1.1 1.003Comparative Example 16 Production Example 68 110 33 0.1 0.990Comparative Example 17 Production Example 69 106 41 1.1 0.999Comparative Example 18 Production Example 70 106 x x 0.999 ComparativeExample 19 Production Example 71 106 32 0.8 0.999 Example 53 ProductionExample 72 106 66 0.1 0.993 Example 54 Production Example 73 108 81 0.10.993

All samples of Examples exhibited a piezoelectric constant d₃₁ of 55[pC/N] or more and a dielectric loss of 0.4% or less. Although not shownin the tables, the piezoelectric constant d₃₃ was also measured based onthe principle of the Berlincourt method and was 110 [pC/N] or more inall samples.

Comparison was made between Examples 10 and 11, between Examples 12 and13, between Examples 19 and 20, and between Examples 21 and 22 in whichx was 0.125≦x≦0.175 and y was 0.055≦y≦0.090. Although x, y, and the Mncontent were the same in all combinations, Examples 11, 13, 19, and 21having a smaller a value exhibited superior piezoelectric constants anddielectric losses. In Examples 11, 13, 19, and 21, the ratio of theamounts of Ba and Ca to the amounts of Ti, Zr, and Mn on a molar basiswas 0.996 or more and 0.999 or less.

Comparison was made between Examples 28 and 29, between Examples 30 and31, between Examples 38 and 39, and between Examples 40 and 41 in whichx was 0.155≦x≦0.300 and y was 0.041≦y≦0.069. Although x, y, and the Mncontent were the same in all combinations, Examples 29, 31, 39, and 41having a smaller a value exhibited superior piezoelectric constants anddielectric losses. In Examples 29, 31, 39, and 41, the ratio of theamounts of Ba and Ca to the amounts of Ti, Zr, and Mn on a molar basiswas 0.993 or more and 0.998 or less.

Similar characteristics were observed in all Examples when the goldelectrodes were replaced by electrodes prepared by baking a silverpaste.

Comparative Examples 1 to 19

Piezoelectric elements of Comparative Examples 1 to 19 were fabricatedby using ceramics of Production Examples 53 to 71. Fabrication andevaluation of the devices were conducted as in Examples 1 to 54.

In Comparative Examples 1 and 15, the dielectric loss was high, i.e.,0.9% to 1.1%, since Mn was not contained. In Comparative Examples 3, 5,7, and 9, the piezoelectric constant d₃₁ was low, i.e., 41 [pC/N] orless, since Zr was not contained. In Comparative Examples 4, 6, 8, and10, the Curie temperature was low, i.e., 60° C., since the Zr contentwas as high as 15%, and the range of temperature at which thepiezoelectric element can be used was narrowed.

In Comparative Example 11, sintering did not progress sufficiently dueto a high Ca content, i.e., 32% (x=0.32), and grain growth was alsoinsufficient. Thus, the piezoelectric constant was low and thedielectric loss was high. In Comparative Example 12, the value of a wasas low as 0.980 and abnormal grain growth, i.e., growth of grains largerthan 30 μm, occurred and the static characteristics other than the Curietemperature could not be evaluated. The average circular equivalentdiameter of crystal grains constituting a piezoelectric material used inthe sample of Comparative Example 12 was significantly larger than thethickness (0.5 mm=500 μm) of the strip-shaped piezoelectric element, andthus the piezoelectric material cleaved easily and the device exhibitedpoor mechanical strength. In Comparative Example 13, a total of 2.1parts by weight of Y and V were contained as the auxiliary componentsand thus the piezoelectric constant d₃₁ was as low as 36 [pC/N]. InComparative Example 14, the value of a was as large as 1.030 and graingrowth was insufficient due to insufficient sintering. Thus, thepiezoelectric constant d₃₁ was as low as 20 [pC/N] and the dielectricloss was as high as 0.9%. In Comparative Example 16, the Mn content wasas high as 0.45 parts by weight and thus the piezoelectric constant waslow although the dielectric loss was low. In Comparative Example 17, theaverage circular equivalent diameter of grains was smaller than 1 μm,the piezoelectric constant was low, and the dielectric loss was high. InComparative Example 18, abnormal growth of grains growing to larger than100 μm in terms of average circular equivalent diameter of the grainswas observed and thus the static characteristics other than the Curietemperature could not be evaluated due to the same reason as the sampleof Comparative Example 12. In Comparative Example 19 in which therelative density was lower than 93%, the piezoelectric constant was lowand the dielectric loss was high. Note that the static characteristicsof Comparative Example 2 were comparable to those of samples ofExamples. In Comparative Example 2, x is 0.05 and y is 0.95, which areabout the same level as the samples of Examples; however, the differencefrom Examples is that y is greater than x.

Evaluation of Dynamic Characteristics of Piezoelectric Element

Dynamic characteristics of the piezoelectric elements were evaluated. Inparticular, the rate of change in piezoelectric constant when voltagewas applied for 100 hours under the following conditions and the powerconsumption were measured.

Dynamic characteristics of Examples 8 to 14, 18 to 22, 25, and 26 andComparative Examples 1, 4, and 19 were evaluated. The piezoelectricconstant d₃₁ after a 110 kHz, 100 V AC voltage sufficiently far from theresonance frequency of the strip-shaped device was applied to astrip-shaped piezoelectric element for 100 hours was evaluated and therate of change was calculated. The rate of change in piezoelectricconstant between before and after the application of the voltage issummarized in Table 5.

TABLE 5 Piezoelectric Piezoelectric constant constant before voltageafter voltage application application Rate of |d₃₁|[pC/N] |d₃₁|[pC/N]change Example 8 104 99  −4.8% Example 9 120 115  −4.2% Example 10 106102  −3.8% Example 11 111 107  −3.6% Example 12 100 96  −4.0% Example 13107 102  −4.7% Example 14 100 97  −3.0% Example 18 111 106  −4.5%Example 19 100 95  −5.0% Example 20 91 87  −4.4% Example 21 90 87  −3.3%Example 22 84 81  −3.6% Example 25 84 81  −3.6% Example 26 116 111 −4.3% Comparative Example 1 125 110 −12.0% Comparative Example 4 140 41−70.7% Comparative Example 19 32 28 −12.5%

Whereas the rate of change in piezoelectric property was 5% or less inall samples of Examples, a rate of change of 10% or more was observed inall samples of Comparative Examples. The cause for this in ComparativeExamples 1 and 19 is presumably that the dielectric loss was high andthus the electrical loss occurring under voltage application was large.Regarding Comparative Example 4, the Curie temperature was as low as 60°C. and thus depolarization presumably occurred due to heat generatedfrom the device under voltage application. In other words, a device doesnot achieve sufficient operation durability unless the Curie temperatureis 85° C. or more and the dielectric loss is 0.4% or less.

Another dynamic characteristic of the piezoelectric element, i.e., thepower consumption, was evaluated as described below. The mechanicalquality factor of Examples 17, 23, 27 to 32, 34, 38 to 42, 45, 46, and49 to 51 and Comparative Examples 2 and 15 was evaluated by aresonance-antiresonance method. The results are shown in Table 6.

Then an AC voltage having a frequency near the resonance frequency (190to 230 kHz) was applied to a strip-shaped piezoelectric element, and therelationship between the vibration speed and the power consumption ofthe device was evaluated. The vibration speed was measured with aDoppler vibrometer and the power consumption was measured with a powermeter. The power consumption observed when the applied voltage andfrequency were changed so that the vibration speed was 0.40 m/s isindicated in Table 6.

TABLE 6 Dielectric Mechanical Power loss quality factor (Ba + Ca)/consumption [%] Qm (Ti + Zr + Mn) [mW] Example 17 0.2 1050 0.997 10Example 23 0.2 1080 0.997 10 Example 27 0.3 480 0.996 19 Example 28 0.2800 1.000 11 Example 29 0.1 1120 0.996 9 Example 30 0.2 1100 0.999 8Example 31 0.1 1400 0.995 7 Example 32 0.1 1450 0.996 7 Example 34 0.11200 0.996 9 Example 38 0.2 640 0.999 16 Example 39 0.1 950 0.996 10Example 40 0.1 860 0.999 13 Example 41 0.1 1110 0.995 9 Example 42 0.11280 0.995 9 Example 45 0.2 1250 0.995 9 Example 46 0.1 1230 0.994 9Example 49 0.1 1340 0.997 8 Example 50 0.1 1370 0.995 8 Example 51 0.11240 0.998 9 Comparative 0.5 190 1.000 54 Example 2 Comparative 1.1 1201.003 65 Example 15

The power consumption of all samples of Examples was 20 mW or lesswhereas the power consumption of all samples of Comparative Examples wasmore than 50 mW. The cause for this is presumably that the mechanicalquality factor of Comparative Examples 2 and 15 was as low as 190 orless. The mechanical quality factor is important when the device isdriven at a frequency near the resonance frequency and is desirably 400or more.

Preparation and Evaluation of Multilayered Piezoelectric Element Example55

Barium titanate having an average particle diameter of 100 nm (BT-01produced by Sakai Chemical Industry Co., Ltd.), calcium titanate havingan average particle diameter of 300 nm (CT-03 produced by Sakai ChemicalIndustry Co., Ltd.), and calcium zirconate having an average particlediameter of 300 nm (CZ-03 produced by Sakai Chemical Industry Co., Ltd.)were weighed so that the ratio was 84.0:10.1:5.9 on a molar basis. Inorder to adjust the molar ratio of Ba and Ca in A sites to Ti and Zr inB sites, 0.028 mol of barium oxalate was added. To the resultingmixture, 0.40 parts by weight of manganese(IV) oxide on a manganesemetal basis and 3 parts by weight of a PVA binder were added and mixed.This mixed powder was formed into a sheet by a doctor blade method toprepare a green sheet having a thickness of 50 μm.

A conductive paste for forming internal electrodes was applied onto thegreen sheet by printing. The conductive paste was a Ni paste. Nine greensheets onto which the conductive paste was applied were stacked and theresulting stack was thermally press-bonded.

The thermally press-bonded stack was fired in a tubular furnace. Firingwas conducted in air up to 300° C. to remove the binder, then theatmosphere was changed to a reducing atmosphere (H₂:N₂=2:98, oxygenconcentration: 2×10⁻⁶ Pa), and a temperature of 1380° C. was retainedfor 5 hours. In the cooling process, the oxygen concentration waschanged to 30 Pa from 1000° C. and below and cooling was conducted toroom temperature.

A sintered body obtained as such was cut into a 10 mm×2.5 mm piece. Theside surfaces of the piece were polished and a pair of externalelectrodes (first and second electrodes) that alternately short-circuitthe internal electrodes were formed on the polished side surfaces by Ausputtering. As a result, a multilayered piezoelectric element as shownin FIG. 3B was fabricated.

The internal electrodes of the multilayered piezoelectric element wasobserved. Layers of nickel, which is an electrode material, and thepiezoelectric material layers were alternately stacked. The multilayeredpiezoelectric element was placed on a hot plate having a surfaceadjusted to 60° C. to 100° C. and an electric field of 1 kV/mm wasapplied to the multilayered piezoelectric element on the hot plate for30 minutes to conduct a polarization treatment.

The piezoelectric properties of the resulting multilayered piezoelectricelement were evaluated. The device had a sufficient insulating propertyand good piezoelectric properties comparable to that of Example 54.

Comparative Example 20

A multilayered piezoelectric element was fabricated as in Example 55.However, the composition was the same as that in Production Example 64.The piezoelectric material layers of the multilayered piezoelectricelement was observed. Several crystal grains having a diameter of 20 to30 μm were observed. Thus, the device was extremely brittle and thepiezoelectric properties could not be evaluated.

Fabrication and Evaluation of Device Liquid Discharge Head Including aPiezoelectric Element of Example 9

A liquid discharge head shown in FIG. 2 was fabricated by using apiezoelectric element of Example 9. Discharge of ink in response toinput electrical signals was confirmed.

Liquid Discharge Apparatus Including a Liquid Discharge Head Including aPiezoelectric Element of Example 9

A liquid discharge apparatus shown in FIG. 6 was fabricated by using aliquid discharge head shown in FIG. 2 including a piezoelectric elementof Example 9. Discharge of ink onto a recording medium in response toinput electrical signals was confirmed.

Ultrasonic Motor Including a Piezoelectric Element of Example 31

An ultrasonic motor shown in FIGS. 3A and 3B was fabricated by using apiezoelectric element of Example 31.

It was confirmed that the motor was rotated in response to the ACvoltage applied.

Lens Barrel Using an Ultrasonic Motor Including a Piezoelectric Elementof Example 31

An optical apparatus shown in FIG. 8 was fabricated by using anultrasonic motor that uses a piezoelectric element of Example 31.Automatic focusing operation in response to applied AC voltage wasconfirmed.

Electronic Apparatus Using a Piezoelectric Acoustic Component Includinga Piezoelectric Element of Example 31

An electronic apparatus shown in FIG. 10 was fabricated by using apiezoelectric acoustic component including a piezoelectric element ofExample 31. Operation of the speaker in accordance with an AC voltageapplied was confirmed.

Liquid Discharge Head Including a Multilayered Piezoelectric Element ofExample 55

A liquid discharge head shown in FIG. 2 was fabricated by using amultilayered piezoelectric element of Example 55. Discharge of ink inresponse to input electrical signals was confirmed.

Liquid Discharge Apparatus Using a Liquid Discharge Head Including aMultilayered Piezoelectric Element of Example 55

A liquid discharge apparatus shown in FIG. 6 was fabricated by using aliquid discharge head shown in FIG. 2 including a multilayeredpiezoelectric element of Example 55. Discharge of ink onto a recordingmedium in response to input electrical signals was confirmed.

Ultrasonic Motor Including a Multilayered Piezoelectric Element ofExample 55

An ultrasonic motor shown in FIG. 3B was fabricated by using amultilayered piezoelectric element of Example 55. Rotation of a motor inresponse to applied AC voltage was confirmed.

Lens Barrel Using an Ultrasonic Motor Including a MultilayeredPiezoelectric Element of Example 55

An optical apparatus shown in FIGS. 8A and 8B was fabricated by using amultilayered piezoelectric element of Example 55. Automatic focusingoperation in response to applied AC voltage was confirmed.

Electronic Apparatus Using a Piezoelectric Acoustic Component Includinga Multilayered Piezoelectric Element of Example 55

An electronic apparatus shown in FIG. 10 was fabricated by using apiezoelectric acoustic component including a multilayered piezoelectricelement of Example 55. Operation of a speaker in response to applied ACvoltage was confirmed.

Other Embodiments

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

INDUSTRIAL APPLICABILITY

A piezoelectric element according to the invention operates stably in awide operating temperature range, has low impact on the environment, andcan be used in apparatuses, such as liquid discharge heads andultrasonic motors, that use a large quantity of piezoelectric materialsin piezoelectric elements, etc.

REFERENCE SIGNS LIST

-   -   1 first electrode    -   2 piezoelectric material    -   3 second electrode    -   101 piezoelectric element    -   102 individual liquid reservoir    -   103 vibrating plate    -   104 partition    -   105 discharge port    -   106 communicating hole    -   107 common reservoir    -   108 buffer layer    -   1011 first electrode    -   1012 piezoelectric material    -   1013 second electrode    -   201 vibrator    -   202 rotor    -   203 output shaft    -   204 vibrator    -   205 rotor    -   206 spring    -   2011 elastic ring    -   2012 piezoelectric element    -   2013 organic adhesive    -   2041 metal elastic member    -   2042 multilayered piezoelectric element    -   51 first electrode    -   53 second electrode    -   54 piezoelectric material layer    -   55 internal electrode    -   501 first electrode    -   503 second electrode    -   504 piezoelectric material layer    -   505 internal electrode    -   506 a external electrode    -   506 b external electrode    -   701 front lens group    -   702 rear lens (focus lens)    -   711 mount    -   712 fixed barrel    -   713 linear guide barrel    -   714 front lens group barrel    -   715 cam ring    -   716 rear lens group barrel    -   717 cam roller    -   718 shaft screw    -   719 roller    -   720 rotation transmitting ring    -   722 roller    -   724 manual focus ring    -   725 ultrasonic motor    -   726 wave washer    -   727 ball race    -   728 focus key    -   729 joint member    -   732 washer    -   733 low friction sheet    -   881 liquid discharge apparatus    -   882 outer casing    -   883 outer casing    -   884 outer casing    -   885 outer casing    -   887 outer casing    -   890 recovery unit    -   891 recording unit    -   892 carriage    -   896 main body    -   897 automatic feeding unit    -   898 discharge slot    -   899 transport unit    -   901 optical device    -   908 release button    -   909 strobe light unit    -   912 speaker    -   914 microphone    -   916 auxiliary light unit    -   931 main body    -   932 zoom lever    -   933 power button

1. A piezoelectric material comprising: crystal grains of aperovskite-type metal oxide represented by general formula (1) as a maincomponent(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (where 1.00≦a≦1.01,0.020≦x≦0.300, 0.020≦y≦0.095, and y≦x)  (1), and a manganese componentincorporated in the piezoelectric material, wherein a manganese contentrelative to 100 parts by weight of the perovskite-type metal oxide is0.02 parts by weight or more and 0.40 parts by weight or less on a metalbasis, wherein an auxiliary component content other than the manganesecomponent relative to 100 parts by weight of the perovskite-type metaloxide is 0.0 parts by weight or more and less than 2.1 parts by weighton an oxide basis, wherein the crystal grains have an average circularequivalent diameter of more than 0.8 μm and less than 182.0 μm, andwherein the piezoelectric material has a relative density of more than89.0% and 100% or less.
 2. A device comprising: a piezoelectric elementhaving: a pair of electrodes; and the piezoelectric material accordingto claim
 1. 3. A piezoelectric material comprising: crystal grains of aperovskite-type metal oxide represented by general formula (1) as a maincomponent(Ba_(1-x)Ca_(x))_(a)(Ti_(1-y)Zr_(y))O₃ (where 1.00≦a≦1.01, 0.02≦x≦0.30,0.020≦y≦0.095, and y≦x)  (1), and a manganese component incorporated inthe piezoelectric material, wherein a manganese content relative to 100parts by weight of the perovskite-type metal oxide is 0.02 parts byweight or more and 0.40 parts by weight or less on a metal basis,wherein an auxiliary component content other than the manganesecomponent relative to 100 parts by weight of the perovskite-type metaloxide is 0.0 parts by weight or more and 1.2 parts by weight or less onan oxide basis, wherein the crystal grains have an average circularequivalent diameter of 1.0 μm or more and 10.8 μm or less, and whereinthe piezoelectric material has a relative density of 91.8% or more and100% or less.
 4. A device comprising: a piezoelectric element having: apair of electrodes; and the piezoelectric material according to claim 3.